Ground plane for exposed package
US6630373B2 · kind B2 · utility
25Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2002 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Feb 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.