Apparatus and method for electrolytically depositing a metal on a workpiece
US6632345B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 2000 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Oct 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with one embodiment of the invention, a process for applying a metal to a workpiece is set forth. The workpiece initially includes a seed layer deposited on at least a portion of a surface thereof that is generally unsuitable for bulk electrochemical deposition. The process starts with this workpiece and repairs the seed layer by depositing a metal using a first electrochemical deposition process to provide a repaired seed layer that is suitable for subsequent bulk electrochemical deposition. After the seed layer has been repaired, a bulk metal deposition over the repaired seed layer is executed by electrochemically depositing a bulk amount of a metal onto the repaired seed layer using a second electrochemical deposition process. The processing parameters of the second electrochemical deposition process are different from processing parameters used in the first electrochemical deposition process. A corresponding apparatus is also set forth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.