Compensation component with improved robustness

US6633064B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Franz Auerbach · Soest, DE
• Gerald Deboy · Klagenfurt, AT
• Hans-Juergen Weber · Verden, DE

Key dates

• Filing date: May 18, 2001
• Grant date: Oct 14, 2003
• Expiry date: May 18, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D64/519

Abstract

The compensation component is formed with compensation regions in a semiconductor between two electrodes. By varying the second field and/or the first field, a location of a maximum field strength is displaced into the center of the compensation regions between the electrodes.