Apparatus and method for measuring the degradation of a tool
US6633379B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 8, 2001 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Sep 5, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/65
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A machining apparatus (10) comprises a material removing tool (12) movably mounted for removing material from a workpiece (14); means for illuminating (42, 54) a sample area upon a tool surface (34) with excitation radiation; means for receiving (42, 54) sample light emitted from the sample area; a spectral analyzer (54) for performing a spectral analysis of the sample light received; and means for determining (60) the condition of the tool at the sample area from the spectral analysis of the sample light. The wear of the tool (12) is determined as such a condition. Operation parameters of the machining apparatus (10) are adjusted according to the determined wear. An example application is a wafer dicing tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.