Apparatus for mounting a land grid array module
US6634095B2 · kind B2 · utility
9Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Aug 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.