Transfer module and cluster system for semiconductor manufacturing process
US6634845B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2000 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Aug 9, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G2249/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A number of process chambers connected to a transfer module can be increased after a cluster system provided with the transfer module is initially established. The transfer module transfers an object to be processed between a transfer chamber and at least one process chamber connected to the transfer chamber. A housing of the transfer module defines the transfer chamber, the housing having a substantially rectangular cross section so that a plurality of the housings are connectable to each other. A movable part is provided in the transfer chamber, the movable part being movable along a base surface provided in the housing of the transfer module. A transfer part is provided on the movable part, the transfer part holding the object to be processed and being movable between the transfer chamber and the process chamber. A drive mechanism drives the movable part, and a control unit controls motion of the movable part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.