Single drive system for a bi-directional linear chemical mechanical polishing apparatus
US6634935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2002 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | May 3, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. Openings within the casting exist for the inclusion of the supply spool, the receive spool and the pad path rollers. A drive assembly translates the rotational movement of a motor into the horizontal bi-directional linear movement of the horizontal slide member. With the polishing pad properly locked in position, preferably being attached between a supply spool and the receive spool, horizontal bi-directional linear movement of the horizontal slide member creates a corresponding horizontal bi-directional linear movement of a portion of the polishing pad. Thus, the portion of the polishing pad disposed within a polishing area of the chemical mechanical polishing apparatus can polish a top front surface of a wafer using the bi-directional linear movement of the portion of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.