Automated spray cleaning apparatus for semiconductor wafers
US6638366B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2001 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B5/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.