Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers
US6638389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Sep 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A tool and method for applying an insert to the face of a chuck so that holes in the insert register with holes in the chuck, includes a removable vacuum chamber that is brought into sealing engagement with the chuck and that is indexed with respect to the chuck by means of locating pins. The removable vacuum chamber includes a stamp on which the insert is mounted and to which the insert is indexed by locating pins. The stamp is advanced until an adhesive surface of the insert contacts the face of the chuck. Thereafter, the vacuum is relieved and the vacuum chamber is removed from the chuck. The tool insures that the holes in the insert register with those in the face of the chuck, and the absence of air within the vacuum chamber prevents air from being trapped between the insert and the face of the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.