Machine vision methods for inspection of leaded components
US6639624B1 · kind B1 · utility
23Cited by
4References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A machine vision method for locating a leaded electronic device, such as integrated circuit chips, includes searching the image with a template depicting only a portion—e.g., one or two “side” edges—of each of one or more of the leads expected on the device. The template can include portions representing expected leads, as well as unexpected leads or unexpected lead positions. Positive and negative weightings are applied to such portions, as appropriate. A location of the device, or of one or more of its leads, is based on the results of the search.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.