Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6645046B1 · kind B1 · utility
20Cited by
27References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Jun 30, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; contacting the polishing member in the conditioning region with a conditioning member; and conditioning the polishing member. The apparatus includes an end effector adapted to receive a conditioning member, the end effector being attached to an arm that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.