Method and apparatus for controlling CMP pad surface finish
US6645052B2 · kind B2 · utility
6Cited by
45References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Oct 26, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.