Method of treating a substrate
US6645550B1 · kind B1 · utility
239Cited by
17References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2000 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Jun 22, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of treating a substrate. The method comprises forming a metal-containing layer on at least a selected portion of the substrate during a substrate cleaning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.