Control system and methods for photolithographic processes

US6645683B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gerhard Luhn · Radebeul, DE
• Daniel Sarlette · Radebeul, DE

Key dates

• Filing date: Jul 31, 2001
• Grant date: Nov 11, 2003
• Expiry date: Dec 8, 2021

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70633
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In the control method for photolithographic processes, line width errors and/or positional errors measured on processed semiconductor wafers are used to calculate correction values for the exposure intensity and/or the xy positioning of the semiconductor wafer. Optimized correction values for a subsequent batch of semiconductor wafers to be processed are calculated by averaging correction values over a number of previously calculated correction values. Only those correction values which lie within a predetermined value range are used in the average.