Submicron dimensional calibration standards and methods of manufacture and use
US6646737B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Apr 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/30444
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A calibration standard which may be used to calibrate lateral dimensional measurement systems is provided. The calibration standard may include a first substrate spaced from a second substrate. In addition, the calibration standard may include at least one layer disposed between the first and second substrates. The layer may have a traceably measured thickness. For example, a thickness of the layer may be traceably measured using any measurement technique in which a measurement system may be calibrated with a standard reference material traceable to a national testing authority. The calibration standard may be cross-sectioned in a direction substantially perpendicular to an upper surface of the first substrate. The cross-sectioned portion of the calibration standard may form a viewing surface of the calibration standard. In this manner, a lateral dimensional artifact of the calibration standard may include the traceably measured thickness of at least the one layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.