Liquid processing apparatus and method
US6647642B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cleaning processing apparatus and method of wafers W held by a rotor capable of holding a plurality of wafers W, which is one embodiment of the liquid processing apparatus of the present invention, comprises an outside chamber, an inside chamber arranged slidable between a process position and a retreat position, and a cleaning mechanism for cleaning the inside chamber in the retreat position. The cleaning mechanism includes a cylindrical body arranged in the inside chamber so as to form a substantially cylindrical cleaning processing space between the inside chamber and the cylindrical body, a cleaning liquid spurting nozzle for spurting a cleaning liquid into the cleaning processing space, and a gas supply nozzle for supplying a predetermined drying gas into the cleaning processing space so as to make it possible to clean and dry the inside chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.