Steam cleaning system and method for semiconductor process equipment
US6648982B1 · kind B1 · utility
3Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Dec 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are systems and methods for removing stubborn contaminants, aluminum fluoride and aluminum chloride in particular, from components of semiconductor-processing equipment. One embodiment forces steam through small holes in a gas distribution plate to remove build up on the interior walls of the holes. A cleaning fixture disposed between the steam source and the gas distribution plate delivers the steam at increased pressures. The gas distribution plate can be immersed in water during cleaning to capture the exiting steam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.