Negative volume expansion lead-free electrical connection
US6649833B1 · kind B1 · utility
6Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Aug 9, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around the solder member which forms a physical connection between the substrate and the device. The volume of the solder member contracts during melting thereof to prevent failure of the physical connection and/or the electrical coupling between the substrate and the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.