Krishna Darbha
17Patents
6h-index
32Co-inventors
62Inventor score
Filing activity: Apr 30, 2001 → Mar 4, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8132976B2 | Reduced impact keyboard with cushioned keys | Electricity | 103 | Active |
| US6528892B2 | Land grid array stiffener use with flexible chip carriers | Electricity | 60 | Expired |
| US6631078B2 | Electronic package with thermally conductive standoff | Emerging Cross-Sectional Technologies | 41 | Expired |
| US7086147B2 | Method of accommodating in volume expansion during solder reflow | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6622786B1 | Heat sink structure with pyramidic and base-plate cut-outs | Electricity | 21 | Expired |
| US7233025B2 | Electronic packaging for optical emitters and sensors | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6686664B2 | Structure to accommodate increase in volume expansion during solder reflow | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7454977B2 | Force measuring systems for digital pens and other products | Physics | 6 | Expired |
| US6649833B1 | Negative volume expansion lead-free electrical connection | Emerging Cross-Sectional Technologies | 6 | Expired |
| US9661770B2 | Graphic formation via material ablation | Emerging Cross-Sectional Technologies | 3 | Active |
| US7796883B2 | Flexible circuit connection | Physics | 1 | Active |
| US7703199B2 | Method to accommodate increase in volume expansion during solder reflow | Emerging Cross-Sectional Technologies | 1 | Active |
| US6905961B2 | Land grid array stiffener for use with flexible chip carriers | Electricity | 1 | Expired |
| US7777722B2 | Multi-mode optical navigation | Physics | 1 | Active |
| US8253688B2 | Multi-mode optical navigation | Physics | 0 | Active |
| US6989607B2 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers | Electricity | 0 | Expired |
| US6639302B2 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.