Injection molded image sensor and a method for manufacturing the same
US6649834B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Dec 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a <CUSTOM-CHARACTER FILE="US06649834-20031118-P00900.TIF" ALT="custom character" HE="20" WI="20" ID="CUSTOM-CHARACTER-00001"/>-shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.