Jichen Wu
21Patents
11h-index
33Co-inventors
64Inventor score
Filing activity: Jan 23, 2001 → Nov 10, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6400007B1 | Stacked structure of semiconductor means and method for manufacturing the same | Electricity | 65 | Expired |
| US6441496B1 | Structure of stacked integrated circuits | Electricity | 43 | Expired |
| US6559539B2 | Stacked package structure of image sensor | Electricity | 26 | Expired |
| US6521881B2 | Stacked structure of an image sensor and method for manufacturing the same | Electricity | 24 | Expired |
| US6627983B2 | Stacked package structure of image sensor | Electricity | 24 | Expired |
| US6680525B1 | Stacked structure of an image sensor | Electricity | 21 | Expired |
| US6590269B1 | Package structure for a photosensitive chip | Electricity | 18 | Expired |
| US6646316B2 | Package structure of an image sensor and packaging | Electricity | 15 | Expired |
| US6649834B1 | Injection molded image sensor and a method for manufacturing the same | Electricity | 13 | Expired |
| US6910637B2 | Stacked small memory card | Electricity | 13 | Expired |
| US6642137B2 | Method for manufacturing a package structure of integrated circuits | Electricity | 11 | Expired |
| US6870208B1 | Image sensor module | Electricity | 10 | Expired |
| US6737720B2 | Packaging structure of image sensor and method for packaging the same | Electricity | 10 | Expired |
| US6747261B1 | Image sensor having shortened wires | Electricity | 8 | Expired |
| US6638097B2 | Probe structure | Electricity | 4 | Expired |
| US6489572B2 | Substrate structure for an integrated circuit package and method for manufacturing the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7126219B2 | Small memory card | Electricity | 3 | Expired |
| US7250324B2 | Method for manufacturing an image sensor | Electricity | 2 | Expired |
| US6878917B2 | Injection molded image sensor and a method for manufacturing the same | Electricity | 0 | Expired |
| US6906397B2 | Image sensor having an improved transparent layer | Electricity | 0 | Expired |
| US7345360B2 | Multiple chips image sensor package | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.