Stackable ceramic fbga for high thermal applications
US6650007B2 · kind B2 · utility
21Cited by
54References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Aug 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.