Method and system for measuring in patterned structures
US6650424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Dec 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measurement method and system are presented for measuring parameters of a patterned structure. Scatterometry and SEM measurements are applied to the structure, measured data indicative of, respectively, the structure parameters and lateral pattern dimensions of the structure are generated. The entire measured data are analyzed so as to enable using measurement results of either one of the scatterometry and SEM measurements for optimizing the other measurement results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.