Method for producing contactless chip cards and corresponding contactless chip card

US6651891B1 · kind B1 · utility

Assignees

• Elke Zakel · DE
• Smart Pac GmbH Technology Services · DE

Inventors

• Elke Zakel · Falkensee, DE
• Rolf Aschenbrenner · Berlin, DE
• Frank Ansorge · Berlin, DE
• Paul Kasulke · Berlin, DE

Key dates

• Filing date: Jun 28, 2000
• Grant date: Nov 25, 2003
• Expiry date: Jun 28, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16227
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

The present invention relates to a method of producing a contactless chip card. In a first step of the method, a card body with one or a plurality of recesses on one card body side is produced from a theremoplastic material, preferably by injection moulding. Bumps being formed on the base surface of the recesses. Subsequently, conductor tracks corresponding to a coil as a conductor track pattern are impressed directly onto surface areas of the card body side including the recesses using a hot impressing technique. The conductor tracks are impressed especially also onto surface areas inside the recesses such that same extends across the bumps. One or a plurality of chips are then aligned in the recesses and contacted with the conductor tracks in the recesses which extend across the bumps. The method according to the present invention is advantageous insofar as it permits a simple production of a chip card, which requires only a few method steps and is therefore also economical. Furthermore, such a chip card is both mechanically stable and reliable, since it comprises very few individual layers and since the conductor tracks of the coil are applied directly to the card body.