Substrate surface processing apparatus and method
US6652662B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1999 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Apr 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A processing apparatus and a processing method are capable of properly and easily obtaining accurate data on the contact pressure applied by an end effector to a workpiece while a process is being carried out. A processing apparatus (7) processes a surface of a wafer (W) held by a spin chuck (22) (holding means) by bringing an end effector (40) into contact with the surface of the wafer (W). The end effector (40) can be retracted from the surface of the wafer (W) to a waiting position (25). A measuring and cleaning device (28) comprises, in combination, a measuring device (26) for measuring contact pressure to be applied to the wafer (W) by the end effector (40), and a cleaning device (27) for cleaning the end effector (40). The measuring device (26) has a table (60) for supporting the end effector (40), and a pressure sensor (62) for measuring a pressure applied to the table (60) to estimate a contact pressure actually applied by the end effector (40) to the wafer (W). The support surface of the table (60) and the surface of the wafer (W) held by the spin chuck (22) are on the same level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.