Method for applying uniform pressurized film across wafer
US6653722B2 · kind B2 · utility
41Cited by
61References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Mar 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.