System and method for drying semiconductor substrate
US6655042B2 · kind B2 · utility
6Cited by
5References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2002 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Feb 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A drying system for drying a semiconductor substrate is provided. The drying system includes: a chamber for housing a vapor distributor and a fluid bath, said fluid bath being disposed in a lower portion of the chamber and said distributor being disposed in an upper portion of the chamber for distributing vapor for drying the substrate; and a fluid flow system for supplying fluid flow into said fluid bath for cleaning and drying the substrate and for draining said fluid from the fluid bath, wherein the chamber includes a plurality of exhaust vents disposed at the upper portion for venting the vapor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.