Integrated pad and belt for chemical mechanical polishing
US6656025B2 · kind B2 · utility
3Cited by
44References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.