Plasma processing apparatus
US6656322B2 · kind B2 · utility
6Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Oct 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32192
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes, in order to enhance the planar uniformity of the plasma density in a process space, a process chamber, an insulating plate attached airtightly to the ceiling of the process chamber, a planar antenna member placed above the insulating plate and including microwave radiation holes for transmitting therethrough microwave used for generating plasma, and a shield electrode member placed between the insulating plate and the planar antenna member for blocking out radiation of the microwave from the center and a part therearound of the planar antenna member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.