Microelectronic assembly formation with lead displacement
US6657286B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Oct 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Leads are connected between first and second elements so that a first end of each lead is connected to the first element and a second end of each lead is connected to the second element. and the elements are moved away from one another so as to bend the leads towards a vertically-extensive disposition. The direction of each lead, prior to the movement step, is represented by a lead direction vector from the first end of the lead to the second end of the same lead. At least some of these lead direction vectors are non-parallel with at least some other lead direction vectors, but the various lead direction vectors have components in a common direction. During the vertical movement step, the first element is moved in a horizontal direction of motion in this common direction, thereby moving the first end of each lead horizontally toward the second end of that lead, so as to provide or maintain slack in the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.