Metallurgical inspection and/or analysis of flip-chip pads and interfaces
US6657707B1 · kind B1 · utility
27Cited by
10References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 24, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Feb 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3457
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Raised electrical contacts, such as Pb-alloy solder bumps or balls utilized in semiconductor IC flip-chip devices, are selectively and readily removed from underlying contact pads by means of a chemical etching process, thereby facilitating metallurgical and/or microstructural inspection and/or analysis of the contact pads for failure analysis, void formation, electromigration, diffusion, loss of adhesion, etc., by a variety of optical and microscopic techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.