Method of manufacturing via interconnection of glass-ceramic wiring board
US6658733B2 · kind B2 · utility
1Cited by
23References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 &mgr;m to at most 4 &mgr;m to the vehicle and blending them, adjusting the viscosity of the vehicle by adding the cellulose derivative and filling them to a via; and sintering the via at a temperature of at least 900° C. to at most 1060° C., and forming the via interconnection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.