Cleaning gas and method for cleaning vacuum treatment apparatus by flowing the cleaning gas
US6659111B1 · kind B1 · utility
280Cited by
10References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 11, 2000 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jan 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/905
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A cleaning gas includes HF gas whose concentration is greater than or equal to 1 vol % and oxygen containing gas whose concentration ranges from 0.5 to 99 vol %. The oxygen containing gas includes at least one of O2 gas, O3 gas, N2O gas, NO gas, CO gas and CO2 gas. The cleaning gas is employed to remove a deposited material generated in a vacuum treatment apparatus for producing a thin film of at least one of Ti, W, Ta, Ru, Ir, a compound thereof and an alloy thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.