Substrate processing apparatus
US6659661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Feb 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a substrate processing apparatus for performing processing of a substrate including: a heat treatment unit provided in a casing of the processing apparatus and having a heating section in which a heat treatment of the substrate is performed; a duct provided on a side part on the heating section side of the casing; and a cooling flow passage provided in the duct for allowing a cooling fluid to flow therethrough. Heat generated from the heating section is prevented from conducting by an air current flowing in the duct, and further the heat is absorbed by the cooling fluid. Therefore, it is possible to prevent the heat from conducting to the outside of the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.