High capacity memory module with built-in performance enhancing features
US6661690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Apr 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.