Method of making a semiconductor device having an opening in a solder mask
US6668449B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jul 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided. Preferably, the pin one indicator/alignment fiducial is placed adjacent a comer area of a ball grid array, and comprises an “L”-shaped narrow opening in a solder mask layer in which two lines, mutually perpendicular to one another, form components of an X-Y axis. The pin one indicator/alignment fiducial of the present invention is configured to provide only a minimal opening in the solder resist, making smaller pitches between solder balls and tighter dimensional controls possible. Therefore, the present invention is particularly useful for packages in which the solder resist surface of the mounting substrate is heavily populated with solder ball contact pads and/or and solder balls, and/or in applications where the chip outline is nearly the s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.