Matt E. Schwab
40Patents
7h-index
9Co-inventors
58Inventor score
Filing activity: Aug 25, 2000 → Apr 23, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6668449B2 | Method of making a semiconductor device having an opening in a solder mask | Emerging Cross-Sectional Technologies | 37 | Expired |
| US9362208B2 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Electricity | 18 | Active |
| US6867500B2 | Multi-chip module and methods | Electricity | 15 | Expired |
| US6882034B2 | Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7868440B2 | Packaged microdevices and methods for manufacturing packaged microdevices | Electricity | 8 | Active |
| US7423336B2 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | Electricity | 8 | Expired |
| US7146720B2 | Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6987325B2 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | Electricity | 6 | Expired |
| US6995043B2 | Methods for fabricating routing elements for multichip modules | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7750449B2 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Electricity | 6 | Active |
| US8354301B2 | Packaged microdevices and methods for manufacturing packaged microdevices | Electricity | 6 | Active |
| US7335571B2 | Method of making a semiconductor device having an opening in a solder mask | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7619313B2 | Multi-chip module and methods | Electricity | 5 | Active |
| US7084514B2 | Multi-chip module and methods | Electricity | 5 | Expired |
| US7095097B2 | Integrated circuit device having reduced bow and method for making same | Electricity | 3 | Expired |
| US7094631B2 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | Electricity | 3 | Expired |
| US7955898B2 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Electricity | 2 | Active |
| US7013559B2 | Method of fabricating a semiconductor device package | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7851922B2 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | Electricity | 2 | Active |
| US6887740B2 | Method for making an integrated circuit package having reduced bow | Electricity | 2 | Expired |
| US7282397B2 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | Electricity | 2 | Expired |
| US7019223B2 | Solder resist opening to define a combination pin one indicator and fiducial | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7282805B2 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | Electricity | 2 | Expired |
| US8048715B2 | Multi-chip module and methods | Electricity | 1 | Active |
| US6577018B1 | Integrated circuit device having reduced bow and method for making same | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.