Eccentric abrasive wheel for wafer processing
US6672943B2 · kind B2 · utility
48Cited by
101References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54493
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.