Krishna Vepa
11Patents
5h-index
11Co-inventors
59Inventor score
Filing activity: Mar 15, 2001 → Nov 30, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6672943B2 | Eccentric abrasive wheel for wafer processing | Electricity | 48 | Expired |
| US6852012B2 | Cluster tool systems and methods for in fab wafer processing | Electricity | 14 | Expired |
| US7402520B2 | Edge removal of silicon-on-insulator transfer wafer | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7208325B2 | Refreshing wafers having low-k dielectric materials | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7775856B2 | Method for removal of surface films from reclaim substrates | Performing Operations; Transporting | 5 | Active |
| US7951718B2 | Edge removal of silicon-on-insulator transfer wafer | Emerging Cross-Sectional Technologies | 2 | Active |
| US7659206B2 | Removal of silicon oxycarbide from substrates | Electricity | 1 | Active |
| US7727782B2 | Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factory | Physics | 0 | Active |
| US7695982B2 | Refurbishing a wafer having a low-k dielectric layer | Emerging Cross-Sectional Technologies | 0 | Active |
| US8874416B2 | Process tool chemical and gas usage optimization | Emerging Cross-Sectional Technologies | 0 | Active |
| US7657390B2 | Reclaiming substrates having defects and contaminants | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.