Substrate processing apparatus
US6673151B2 · kind B2 · utility
16Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2003 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Jan 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spin chuck for holding a wafer to the front face of which a resist solution is supplied, a cup for housing the spin chuck and forcibly exhausting an atmosphere around the wafer by exhaust from the bottom thereof, and an air flow control plate, provided in the cup to surround the outer periphery of the wafer, for controlling an air flow in the vicinity of the wafer are provided. Accordingly, a state of special air flow at an outer edge portion of a substrate to be processed can be eliminated, thereby preventing an increase in film thickness at the outer edge portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.