Method for confirming alignment of a substrate support mechanism in a semiconductor processing system
US6677166B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Feb 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49769
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.