Silicon plugs and local interconnect for embedded memory and system-on-chip (SOC) applications
US6677650B2 · kind B2 · utility
8Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Jan 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for fabricating system-on-chip devices which contain embedded DRAM along with other components such as SRAM or logic circuits is disclosed. Local interconnects, via salicides and tungsten are formed subsequent to polysilicon plugs required for the operation of the DRAM and SRAM or logic. Also disclosed are systems-on-chips MIM/MIS capacitive devices produced by the inventive process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.