Stacked structure of an image sensor
US6680525B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2003 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Jan 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.