Semiconductor build-up package
US6680529B2 · kind B2 · utility
99Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Apr 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor build-up package includes a die, a circuit board and at least a dielectric layer. The circuit board has a surface for building up the dielectric layer, and the surface has a cavity for accommodating the die. The inside of multi-layer circuit board has conductive traces for expanding the electrical function of semiconductor build-up package. Each dielectric layer has conductive columns so that the die may electrically connect with the outermost dielectric layer. At least a conductive column is bonded on the surface of the multi-layer circuit board for inner electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.