UV-curable compositions and method of use thereof in microelectronics
US6682872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2002 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.