Method and apparatus for measuring thickness of thin film
US6683308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2003 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Jan 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A film thickness measuring apparatus applies an electron beam to a thin film as a measurement object formed on a substrate, and measures a value of substrate current that flows in the substrate thereupon. The film thickness measuring apparatus corrects the substrate current value taking into account an influence of a charge distribution generated in the neighborhood of the thin film due to the application of the electron beam or an influence of a configuration of the surface of the substrate in the neighborhood of the thin film. The film thickness measuring apparatus acquires reference data representing a correlation between film thicknesses and substrate current values with respect to standard samples and calculates a thickness of the thin film from the corrected substrate current value taking into account the reference data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.