Method and apparatus for providing rotational burn-in stress testing
US6683467B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Dec 22, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and device are provided for stress testing a chip. The chip may be partitioned into at least a first block and a second block. Burn-in stress testing may be performed on electronic devices within the first block without simultaneously performing burn-in stress testing on electronic devices within the second block. A burn-in stress testing device may perform the burn-in testing. A control device may be coupled to the burn-in stress testing device to enable burn-in stress testing on electronic devices within at least the first block of the chip without simultaneously enabling burn-in stress testing on the second block of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.