Control mechanism for matching process parameters in a multi-chamber process tool
US6684122B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2000 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Jan 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
The invention, in its various aspects and embodiments, is a method and apparatus for controlling the operation of a multi-chamber process tool in a semiconductor fabrication process. The method comprises setting a plurality of operation parameters for the conduct of a predetermined operation in each of a plurality of process chambers in a multi-chamber process tool; performing the predetermined operation in each of the process chambers; examining a physical characteristic of a processed wafer from each of the process chambers; determining from the examined physical characteristics whether the operating conditions in each of the process chambers match; and resetting at least one operating parameter so that the operating conditions in each of the process chambers will match. The apparatus comprises a processing tool, a review station, and a tool controller. The processing tool includes a plurality of process chambers and an operation controller. Each process chamber is capable of performing a predetermined operation defined by a plurality of operating parameters. The operation controller is capable of setting the operating parameter for each of the process chambers. The review statio…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.