Transferable resilient element for packaging of a semiconductor chip and method therefor
US6686015B2 · kind B2 · utility
30Cited by
39References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Jun 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the the first liner. The plurality of resilient elements adhere to the tacky material so that upon removal of the plurality of resilient elements from the liner, the tacky material will adhere to the plurality of resilient elements and provide a tacky surface thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.