Patent · US Expired

Vertical MOSFET with asymmetric gate structure

US6686245B1 · kind B1 · utility

230Cited by
5References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 20, 2002
Grant dateFeb 3, 2004
Priority date
Expiry dateDec 20, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/292

Abstract

A semiconductor fabrication process and structure in which a semiconductor channel structure (140) having first and second major surfaces perpendicular to a semiconductor substrate (102) is formed overlying and electrically isolated from the substrate (102). First and second gate dielectrics (120, 142) are formed on the channel structure's first and second major surfaces respectively. First and second gate dielectrics (120, 142) differ in at least one characteristic. First and second gate electrodes (116, 152) are formed in contact with the first and second gate dielectrics (120, 142) respectively. The first and second gate electrodes (116, 152) differ in at least one characteristic. First and second gate dielectrics (120, 142) may have different dielectric constants while first and second gate electrodes (116, 152) may have different doping and conducting properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.